Easy to operate and multi-function AOI

Different AOI model can be placed at several quality controlling points in SMT line such as to check 2D paste printing quality,
check component defects before reflow soldering, check PCBA quality after reflow soldering,
and DIP after wave soldering.

The Z5 is the inland first AOI to inspect the component side of PTH technique

Avaible height :50mm～90mm;
Safety distance: 50mm
Identifiable component height: 1mm～50mm
Adjust method: Automatically
Can customized above height for customer

Multi-functional intelligent AOI with high resolution industrial camera system, capture quality defects at every moment

The patented Z axis adjustable AOI can inspect component side of PTH；
Simpler debugging algorithm, make the programming easier and easy to learn；
Automatic identify the positive and negative side, auto software origin emendation；
Multi marks 、multi barcode、bad marks identify convenient for programming and debugging；
OCR (Optical Character Recognition) function applied on AOI improving the accuracy rate of wrong part；
Share date among AOI internal network.

Intelligent color analysis technology

Using color extract and Analysis Technology (CPAT) can extract the object shape more correctly and gain highly precision of the inspection；
The application of multi-marks and multi-boards can be more adapted the demands of the production tests and give you many scene applications.

color extract and Analysis Technology (CPAT)

Intelligent solder ball inspection algorithm

Implements algorithm inboard face color, luminance, shape and color of solder balls, test solder balls of PCB and around single components, and also implement solder ball testing through overall PCB frame.

Intelligent solder ball inspection algorithm

One inspection box multi algorithm

Many algorithms application and combination will enhance the pass rate and reduce the rate of misjudging greatly.
One inspection box can use two or more algorithms, such as “Color” extract and “Similarity” and so on, no need draw more inspection box. Which greatly increase testing efficiency.

One inspection box multi algorithm

Inquiry online

0755-61519009/61519062

CATEGORY	ITEM		SPECIFICATION
RECOGNITION SYSTEM	INSPECTION		using multiple algorithms synthetically such as WIDM、Color Image contrast technology、Color extracting technology, similarity, two-value handling technology 、OCR Contour analysis 、Solder ball inspection and Wave DIP analysis technology and so on.
	CAMERA		Color CCD camera: 12um/15um/20um for option.
	LAMP-HOUSE		4 Rings RGBB LED lamp-house，with special coaxial optical for option.
	IMAGE PROCESSING SPEED	01005CHIP
	IMAGE PROCESSING SPEED	PER-IMAGE TIME
	INSPECTION ITEMS	PASTE PRINTIG DEFECTS	Misaligned, overflow, insufficient, pasting open, stain
		COMPONENT DEFECTS	Missing, misaligned, skewed, tombstone, billboard, overtumed, reversed polarty, wrong, damaged
		SOLDER DEFECTS	Overflow, insufficient, short solder, stain，false solder
		WAVE SOLDERING INSPECT	Overflow, insufficient, short, Excess Solder, solder void
	ANTI STATIC MEASURES		Anti static electric outlet, anti static wreath
MECHANISM SYSTEM	PCB SIZE		25×25mm - 330×480mm, can make bigger size according to clients’ demands
	PCB THICKNESS		0.5mm - 2.5mm
	PCB WARP TOLERANCE		<2mm
	COMPONENT CLEARANCE		TOP≤50mm；BOT≤75mm
	MINIMUM SPACE PARTS		20um 0201 Chip 0.4Pitch IC
	MINIMUM SPACE PARTS		15um 01005 Chip 0.3Pitch IC
	X、Y PLATFORM & Z AXIS	DRIVER	AC server
		ORIENTATION	<10μm
		MOVING SPEED	700mm/s
		Z AXIS（Only Z5X ）	Height adjust between 50mm～90mm, safety distance 50mm
			Identifiable component height：1mm～50mm
			Adjust method：Automatically
SOFT SYSTEM	OPERATION SYSTEM		Microsoft Windows XP Professional/Windows 7
	CONTROLLING & RECOGNIZING	CHARACTERISTICS	WIDM, study OK template, automatically set template imaging, identify data and error numerical value. The camera and lamp can adjust height and focus to ensure the inspection precision.
	CONTROLLING & RECOGNIZING	OPERATION	Graphic programming, take along with chip library and get a inspection frame according with chip shape, aureate position, micron adjust, and easy programming
	Mark	MARK NUMBERS	3marks can be chosen
	Mark	RECOGNISING SPEED	0.5s/pcs
CONTROLLER	COMPUTER		CPU:I Intel Dual Core , MEMORY:4G, HARDDISK: 500G
CONTROLLER	DISPLAY		22 inch TFT
OTHERS	MACHINE DIMENSIONS （LWH）		105cm×108cm×135cm
	WEIGHT		About 500kg
	POWER SUPPLY		AC220V, 10%, single phase 5A 50/60HZ, power consumption 600W(Z5X 800W)

三維立體成像

三維立體成像是相位調(diào)制輪廓測量技術(shù)（PMP）基于結(jié)構(gòu)
光柵正弦運動投影，離散相移獲取多幅被照射物光場圖像，
再根據(jù)多步相移法計算出相位分布，最后利用三角測量等方
法得到高精度的物體外形輪廓和體積測量結(jié)果。

真彩色的三維立體影像顯示。

快速編程

快速編程是支持RS274-D、RS274-X格式的Gerber文件及
支持dxf格式的CAD文件，導(dǎo)入文件后自動創(chuàng)建焊盤信息，
只需設(shè)置檢測參數(shù)即可完成編程。

全面詳盡的SPC分析系統(tǒng)

SPC統(tǒng)計分析是利用統(tǒng)計方法對過程中的各個階段進行過程控制，通過對測試信息的分析反饋，來促進前工序工藝的改良，以達(dá)到預(yù)防不良。操作者可以直觀的通過餅狀圖或者柱形圖等查看到測試信息的綜合統(tǒng)計。

統(tǒng)計信息可以輸出Html，Excel或Image等格式。